Patent Assignment
Reel/Frame 047611/0070
Assignment of Assignor's Interest
Recorded: 2018-11-28
Pages: 5
Assignors
LEE, DOO HWAN
Executed: 2018-11-16
KIM, YONG HOON
Executed: 2018-11-16
CHO, TAE JE
Executed: 2018-11-12
LEE, JIN WON
Executed: 2018-11-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Having Embedded Interconnect Structure