Patent Assignment
Reel/Frame 047612/0718
Assignment of Assignor's Interest
Recorded: 2018-11-28
Pages: 2
Assignor
CHO, HAN SIN
Executed: 2018-11-20
Assignee
HYUNDAI AUTRON CO., LTD.
12, TEHERAN-RO 113-GIL, GANGNAM-GU, SEOUL, 06171, KOREA, REPUBLIC OF
Covered Property
(1)
Power Chip Integration Module, Manufacturing Method Thereof, and Double-Sided Cooling Power Module Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 26, 2021
From: HYUNDAI AUTRON CO., LTD.
To: HYUNDAI MOTOR COMPANY
Reel/Frame 055426/0553 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 055426 Frame: 0553. Assignor(S) Hereby Confirms the Assignment.
Apr 16, 2021
From: HYUNDAI AUTRON CO., LTD.
To: HYUNDAI MOBIS CO., LTD.
Reel/Frame 055953/0027 →