IP Library › Assignment 047613/0765
Patent Assignment
Reel/Frame 047613/0765

Assignment of Assignor's Interest

Recorded: 2018-11-28 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2016-08-01
LEE, HENG CHEN
Executed: 2016-08-03
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semicoductor Wafer and Method of Backside Probe Testing Through Opening in Film Frame
Application: 16/203,570 →
Publication: US 2019/0096777
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 13, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 048327/0670 →
Release of Security Interest in Patents Recorded at Reel 048327, Frame 0670 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0001 →