Patent Assignment
Reel/Frame 047626/0188
Assignment of Assignor's Interest
Recorded: 2018-11-29
Pages: 3
Assignors
HU, HONGMEI
Executed: 2018-11-29
HUANG, TIAN
Executed: 2018-11-09
JIN, YUHUI
Executed: 2018-11-19
Assignee
CORNING INCORPORATED
SP-TI-3-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Methods for Etching Vias in Glass-Based Articles Employing Positive Charge Organic Molecules