Patent Assignment
Reel/Frame 047630/0621
Assignment of Assignor's Interest
Recorded: 2018-11-30
Pages: 4
Assignors
MAO, YI-CHAO
Executed: 2018-08-14
CHANG, CHIN-CHUAN
Executed: 2018-08-14
LU, SZU-WEI
Executed: 2018-08-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and System for Substrate Thinning