IP Library › Assignment 047643/0175
Patent Assignment
Reel/Frame 047643/0175

Assignment of Assignor's Interest

Recorded: 2018-11-30 Pages: 5
Assignors
MARUYAMA, TSUNEO
Executed: 2018-11-16
TAMURA, YOSHIKI
Executed: 2018-11-16
SAKAI, HIDEO
Executed: 2018-11-16
Assignee
DIAMET CORPORATION
1-1, KOGANE-CHO 3-CHOME, HIGASHI-KU, NIIGATA-SHI, NIIGATA, 950-8640, JAPAN
Covered Property (1)
Molding Die and Molding Method
Application: 16/306,349 →
Publication: US 2019/0344349