IP Library › Assignment 047646/0040
Patent Assignment
Reel/Frame 047646/0040

Assignment of Assignor's Interest

Recorded: 2018-11-30 Pages: 5
Assignors
QIN, SHU
Executed: 2014-01-30
ZHANG, MING
Executed: 2014-02-03
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Devices, Systems and Methods for Electrostatic Force Enhanced Semiconductor Bonding
Application: 16/206,895 →
Publication: US 2019/0096732
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 11 to Patent Security Agreement Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048082/0860 →
Supplement No. 2 to Patent Security Agreement Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048082/0889 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050718/0764 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051026/0568 →