Patent Assignment
Reel/Frame 047663/0798
Assignment of Assignor's Interest
Recorded: 2018-12-04
Pages: 10
Assignors
WENG, CHEN-YI
Executed: 2018-11-27
JHANG, JING-YIN
Executed: 2018-11-27
WANG, HUI-LIN
Executed: 2018-11-27
HSIEH, CHIN-YANG
Executed: 2018-11-27
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof