Patent Assignment
Reel/Frame 047668/0814
Assignment of Assignor's Interest
Recorded: 2018-12-04
Pages: 3
Assignors
JIAO, MEIZI
Executed: 2018-07-30
ZHANG, CHONG
Executed: 2018-07-30
FENG, HONGXIA
Executed: 2018-07-30
MCCARTHY, KEVIN
Executed: 2018-07-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Lithographically Defined Vertical Interconnect Access (via) in Dielectric Pockets in a Package Substrate