Patent Assignment
Reel/Frame 047678/0253
Assignment of Assignor's Interest
Recorded: 2018-12-05
Pages: 9
Assignors
LI, SHENG-CHAN
Executed: 2018-11-13
CHOU, CHENG-HSIEN
Executed: 2018-11-13
TSAI, CHENG-YUAN
Executed: 2018-11-13
HUANG, CHIH-HUI
Executed: 2018-11-13
WU, KUO-MING
Executed: 2018-11-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bonding Support Structure (and Related Process) for Wafer Stacking