IP Library › Assignment 047678/0553
Patent Assignment
Reel/Frame 047678/0553

Assignment of Assignor's Interest

Recorded: 2018-12-05 Pages: 4
Assignor
NEVES, ROBERT
Executed: 2018-12-04
Assignee
GREATER ASIA PACIFIC LIMITED
FLAT/RM B, 9/F, BULKIN CENTRE ST, MONGKOK, KL, HONG KONG
Covered Property (1)
Printed Circuit Board Test Coupon for Electrical Testing During Thermal Exposure and Method of Using the Same
Application: 16/209,853 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 10, 2022
From: GREATER ASIA PACIFIC LIMITED
To: RELIABILITY ASSESSMENT SOLUTIONS INC.
Reel/Frame 061362/0781 →