Patent Assignment
Reel/Frame 047690/0105
Assignment of Assignor's Interest
Recorded: 2018-12-06
Pages: 14
Assignors
MURUKESAN, KARTHICK
Executed: 2018-12-05
CHIANG, WEN-CHIH
Executed: 2018-10-12
CHUNG, CHIU-HUA
Executed: 2018-10-05
TSAI, CHUN LIN
Executed: 2018-10-17
WU, KUO-MING
Executed: 2018-10-25
LIN, SHIUAN-JENG
Executed: 2018-09-26
LIN, TIEN SHENG
Executed: 2018-10-04
CHEN, YI-MIN
Executed: 2018-10-17
LIN, HUNG-CHOU
Executed: 2018-10-16
CHIU, YI-CHENG
Executed: 2018-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bootstrap Metal-Oxide-Semiconductor (Mos) Device Integrated with a High Voltage Mos (Hvmos) Device and a High Voltage Junction Termination (Hvjt) Device