Patent Assignment
Reel/Frame 047704/0504
Assignment of Assignor's Interest
Recorded: 2018-12-07
Pages: 6
Assignors
SEONG, GEUM JUNG
Executed: 2018-10-31
HONG, SEUNG SOO
Executed: 2018-10-31
OH, YOUNG MOOK
Executed: 2018-10-31
LEE, JEONG YUN
Executed: 2018-10-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same