Patent Assignment
Reel/Frame 047709/0913
Assignment of Assignor's Interest
Recorded: 2018-12-07
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Patterning Polymer Layer to Reduce Stress
Patent:
10,522,488 →
Application:
16/176,078 →