Patent Assignment
Reel/Frame 047722/0304
Assignment of Assignor's Interest
Recorded: 2018-12-10
Pages: 2
Assignors
HORIKAWA, YASUYOSHI
Executed: 2018-10-29
IHARA, YOSHIHIRO
Executed: 2018-10-29
KITA, YOSHIHIRO
Executed: 2018-10-30
TANAKA, HIKARU
Executed: 2018-10-30
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Folded Substrate for Stacked Integrated Circuit Devices