Patent Assignment
Reel/Frame 047723/0909
Assignment of Assignor's Interest
Recorded: 2018-12-10
Pages: 4
Assignor
KIM, WON-YOUNG
Executed: 2018-10-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Chip Stack