Semiconductor package having chip stack

1. A semiconductor package, comprising:

a substrate;

a first semiconductor chip on the substrate;

a first second semiconductor chip on a top surface of the first semiconductor chip and partially exposing the top surface of the first semiconductor chip, the first second semiconductor chip having a same size as the first semiconductor chip and having a same storage capacity as the first semiconductor chip;

a first chip connector on the exposed top surface of the first semiconductor chip and coupled to the first semiconductor chip and the first second semiconductor chip; and

a connector for power or ground coupled to the substrate and coupled to a top surface of the first second semiconductor chip, the connector for power or ground being spaced apart from the first semiconductor chip to provide the first second semiconductor chip with power or ground without passing through an integrated circuit section of the first semiconductor chip.

2. The semiconductor package as claimed in claim 1 , further comprising a signal connector on the exposed top surface of the first semiconductor chip, the signal connector being electrically connected to the substrate and the first semiconductor chip.

3. The semiconductor package as claimed in claim 2 , wherein the integrated circuit section of the first semiconductor chip is electrically connected to the signal connector and the first chip connector.

4. The semiconductor package as claimed in claim 2 , wherein the first semiconductor chip includes:

a first signal pad on the exposed top surface and coupled to the signal connector; and

a second signal pad on the exposed top surface and coupled to the first chip connector.

5. The semiconductor package as claimed in claim 1 , wherein the first chip connector includes a bonding wire or a wiring line pattern.

6. The semiconductor package as claimed in claim 1 , further comprising:

a second second semiconductor chip stacked on the first second semiconductor chip; and

a second signal connector on the exposed top surface of the first semiconductor chip and electrically connected to the first semiconductor chip and the second second semiconductor chip,

wherein the connector for power or ground is at a location, the location vertically overlapped by the second second semiconductor chip.

7. The semiconductor package as claimed in claim 6 , wherein the second second semiconductor chip is aligned with the first second semiconductor chip in a direction that is perpendicular to a top surface of the substrate.

8. A semiconductor package, comprising:

a substrate;

a first semiconductor chip on the substrate, the first semiconductor chip having a first region and a second region in a plan view;

a first second semiconductor chip on a top surface of the second region of the first semiconductor chip, the first second semiconductor chip exposing the first region;

a second second semiconductor chip stacked on the first second semiconductor chip;

a third second semiconductor chip stacked on the second second semiconductor chip;

a third pad on the top surface of the first region and electrically connected to the second second semiconductor chip; and

a fourth pad on the top surface of the first region and electrically connected to the third second semiconductor chip, wherein:

the first semiconductor chip includes:

a first pad on a top surface of the first region and electrically connected to the substrate; and

a second pad on the top surface of the first region and electrically connected to the first second semiconductor chip,

the first second semiconductor chip has a same size as the first semiconductor chip and has a same shape as the first semiconductor chip,

each of the second second semiconductor chip and the third second semiconductor chip has the same size as the first semiconductor chip and has a same storage capacity as the first semiconductor chip,

the first pad and the fourth pad are spaced apart at a first interval,

the second pad and the third pad are spaced apart at a second interval,

the third pad and the fourth pad are spaced apart at a third interval, and

the first interval is less than the second interval and the third interval, or the third interval is greater than the first interval and the second interval.

9. The semiconductor package as claimed in claim 8 , wherein:

the first semiconductor chip includes an integrated circuit section, and

the first pad is electrically connected through the integrated circuit section to the second pad.

10. The semiconductor package as claimed in claim 8 , wherein the first second semiconductor chip has a same storage capacity as the first semiconductor chip.

11. The semiconductor package as claimed in claim 8 , wherein

the first interval is less than the second interval and the third interval.

12. The semiconductor package as claimed in claim 8 , wherein

the third interval is greater than the first interval and the second interval.

13. The semiconductor package as claimed in claim 8 , further comprising a bonding wire for power or ground, wherein:

the bonding wire is coupled to the first second semiconductor chip and the substrate, and

the bonding wire is spaced apart from the first semiconductor chip.

14. The semiconductor package as claimed in claim 8 , further comprising:

a first bonding wire coupled to the first pad and a signal pad of the substrate; and

a second bonding wire coupled to the second pad and a chip pad of the first second semiconductor chip.