Patent Assignment
Reel/Frame 047727/0708
Assignment of Assignor's Interest
Recorded: 2018-12-10
Pages: 4
Assignors
YAN, MENG
Executed: 2018-10-16
ZHU, JIFENG
Executed: 2018-10-16
HU, SI PING
Executed: 2018-10-11
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, WUHAN, HUBEI, CHINA
Covered Property
(1)
Method for Forming Lead Wires in Hybrid-Bonded Semiconductor Devices