Patent Assignment
Reel/Frame 047744/0315
Assignment of Assignor's Interest
Recorded: 2018-12-11
Pages: 20
Assignors
LIU, JUN
Executed: 2018-06-09
HUANG, YONGCHAO
Executed: 2018-06-09
SU, TONGSHANG
Executed: 2018-06-09
CHENG, LEILEI
Executed: 2018-06-09
WANG, JUN
Executed: 2018-06-09
LIU, NING
Executed: 2018-06-09
Assignees
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
XINZHAN INDUSTRIAL PARK, ANHUI, HEFEI, 230012, CHINA
Covered Property
(1)
Method for Fabricating a Contact Hole of an Array Substrate, Array Substrate and Display Device