Patent Assignment
Reel/Frame 047756/0138
Assignment of Assignor's Interest
Recorded: 2018-12-12
Pages: 2
Assignor
HAIRSTON, ALLEN W.
Executed: 2018-11-14
Assignee
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
PO BOX 868, NASHUA, NEW HAMPSHIRE, 03061-0868
Covered Property
(1)
Heat Spreaders for Semiconductor Devices, and Associated Systems and Methods
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 29, 2018
From: QU, XIAOPENG; GRIFFIN, AMY R.; CHUN, HYUNSUK
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047629/0896 →
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →