Patent Assignment
Reel/Frame 047760/0443
Assignment of Assignor's Interest
Recorded: 2018-12-13
Pages: 5
Assignors
LIU, ZI-JHENG
Executed: 2018-11-22
KUO, HUNG-JUI
Executed: 2018-11-22
HO, MING-CHE
Executed: 2018-11-22
LEE, MING-TAN
Executed: 2018-11-26
LEE, TZUNG-HUI
Executed: 2018-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same