Patent Assignment
Reel/Frame 047764/0986
Assignment of Assignor's Interest
Recorded: 2018-12-13
Pages: 7
Assignors
OH, JOONG GUN
Executed: 2018-11-16
PARK, SUNG IL
Executed: 2018-11-16
PARK, JAE HYUN
Executed: 2018-11-16
LEE, HYUNG SUK
Executed: 2018-11-16
PARK, EUN SIL
Executed: 2018-11-16
LEE, YUN IL
Executed: 2018-11-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same