Patent Assignment
Reel/Frame 047769/0913
Assignment of Assignor's Interest
Recorded: 2018-12-13
Pages: 4
Assignors
GAO, GUILIAN
Executed: 2018-11-05
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2018-11-05
MIRKARIMI, LAURA WILLS
Executed: 2018-12-12
KATKAR, RAJESH
Executed: 2018-11-05
MOHAMMED, ILYAS
Executed: 2018-11-09
UZOH, CYPRIAN EMEKA
Executed: 2018-11-06
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Layer Structures for Making Direct Metal-to-Metal Bonds at Low Temperatures in Microelectronics
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →