Patent Assignment
Reel/Frame 073173/0300
Change of Name
Recorded: 2025-10-20
Pages: 5
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(31)
Heterogeneous Annealing Method and Device
Heterogeneous Device
Conductive Barrier Direct Hybrid Bonding
Conductive Barrier Direct Hybrid Bonding
Increased Contact Alignment Tolerance for Direct Bonding
Increased Contact Alignment Tolerance for Direct Bonding
Stacked Dies and Methods for Forming Bonded Structures
Stacked Dies and Methods for Forming Bonded Structures
Interface Structures and Methods for Forming Same
Bonded Structures
Structure with Integrated Metallic Waveguide
Bonded Structures
Interface Structures and Methods for Forming Same
Chemical Mechanical Polishing for Hybrid Bonding
Cavity Packages
Bonded Structures
Integrated Optical Waveguides, Direct-Bonded Waveguide Interface Joints, Optical Routing and Interconnects
Layer Structures for Making Direct Metal-to-Metal Bonds at Low Temperatures in Microelectronics
Bond Enhancement Structure in Microelectronics for Trapping Contaminants During Direct-Bonding Processes
Bonded Structures
Microelectronic Assemblies
Stacked Devices and Methods of Fabrication
Interconnect Structures
Post Cmp Processing for Hybrid Bonding
Method and Structures for Low Temperature Device Bonding
Bonded Structures Without Intervening Adhesive
Mitigating Surface Damage of Probe Pads in Preparation for Direct Bonding of a Substrate
Direct Bonded Stack Structures for Increased Reliability and Improved Yield in Microelectronics
Offset Pads Over Tsv
Protective Elements for Bonded Structures
Wafer-Level Bonding of Obstructive Elements
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 8, 2015
From: ENQUIST, PAUL M.
To: ZIPTRONIX, INC.
Reel/Frame 036760/0590 →
Assignment of Assignor's Interest
Nov 24, 2015
From: ENQUIST, PAUL M.
To: ZIPTRONIX, INC.
Reel/Frame 037130/0840 →
Assignment of Assignor's Interest
Jun 3, 2016
From: UZOH, CYPRIAN EMEKA; SITARAM, ARKALGUD R.; ENQUIST, PAUL
To: ZIPTRONIX, INC.
Reel/Frame 038799/0952 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
Dec 15, 2016
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.; DELACRUZ, JAVIER A.
To: ZIPTRONIX, INC.
Reel/Frame 040964/0869 →
Assignment of Assignor's Interest
Jan 11, 2017
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.; HABA, BELGACEM
To: ZIPTRONIX, INC.
Reel/Frame 040946/0479 →
Assignment of Assignor's Interest
Jan 11, 2017
From: WANG, LIANG; KATKAR, RAJESH; DELACRUZ, JAVIER A.; SITARAM, ARKALGUD R.
To: ZIPTRONIX, INC.
Reel/Frame 040945/0601 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Assignment of Assignor's Interest
Jul 25, 2017
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.
To: ZIPTRONIX, INC.
Reel/Frame 043090/0958 →
Change of Name
Dec 7, 2017
From: ZIPTRONIX, INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 044759/0797 →
Assignment of Assignor's Interest
Jan 25, 2018
From: HUANG, SHAOWU; DELACRUZ, JAVER A.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 044732/0170 →
Assignment of Assignor's Interest
May 25, 2018
From: ENQUIST, PAUL M.; WANG, LIANG; KATKAR, RAJESH; DELACRUZ, JAVIER A.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 045906/0377 →
Assignment of Assignor's Interest
Sep 6, 2018
From: KATKAR, RAJESH; WANG, LIANG
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 046804/0943 →
Assignment of Assignor's Interest
Dec 6, 2018
From: FOUNTAIN, GAIUS GILLMAN, JR.; MANDALAPU, CHANDRASEKHAR; UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 047698/0362 →
Assignment of Assignor's Interest
Jan 14, 2019
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.; WANG, LIANG; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 047992/0749 →
Assignment of Assignor's Interest
Jan 29, 2019
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.; WANG, LIANG; KATKAR, RAJESH
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 048165/0358 →
Change of Name
Mar 1, 2019
From: ZIPTRONIX, INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 048482/0697 →
Assignment of Assignor's Interest
Mar 1, 2019
From: ENQUIST, PAUL M.
To: ZIPTRONIX, INC.
Reel/Frame 048478/0119 →
Change of Name
Mar 8, 2019
From: ZIPTRONIX, INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 048552/0572 →
Assignment of Assignor's Interest
Mar 8, 2019
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.; DELACRUZ, JAVIER A.
To: ZIPTRONIX, INC.
Reel/Frame 048552/0659 →
Assignment of Assignor's Interest
May 3, 2019
From: UZOH, CYPRIAN EMEKA; SITARAM, ARKALGUD R.; ENQUIST, PAUL
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 049077/0910 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Assignment of Assignor's Interest
Jul 22, 2020
From: FOUNTAIN, GAIUS GILLMAN, JR.; MANDALAPU, CHANDRASEKHAR; UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053284/0895 →
Assignment of Assignor's Interest
Aug 5, 2020
From: HUANG, SHAOWU; HABA, BELGACEM; DELACRUZ, JAVIER A.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053408/0626 →