Patent Assignment
Reel/Frame 038799/0952
Assignment of Assignor's Interest
Recorded: 2016-06-03
Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2016-05-18
SITARAM, ARKALGUD R.
Executed: 2016-05-18
ENQUIST, PAUL
Executed: 2016-05-18
Assignee
ZIPTRONIX, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Stacked Dies and Methods for Forming Bonded Structures
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →