IP Library › Assignment 036760/0590
Patent Assignment
Reel/Frame 036760/0590

Assignment of Assignor's Interest

Recorded: 2015-10-08 Pages: 3
Assignor
ENQUIST, PAUL M.
Executed: 2015-10-07
Assignee
ZIPTRONIX, INC.
5400 GLENWOOD AVE., SUITE G-05, RALEIGH, NORTH CAROLINA, 27612
Covered Property (1)
Conductive Barrier Direct Hybrid Bonding
Patent: 9,953,941 →
Application: 14/835,379 →
Publication: US 2017/0062366
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 24, 2015
From: ENQUIST, PAUL M.
To: ZIPTRONIX, INC.
Reel/Frame 037130/0840 →
Change of Name Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →