IP Library Assignment 048478/0119
Patent Assignment
Reel/Frame 048478/0119

Assignment of Assignor's Interest

Recorded: 2019-03-01 Pages: 2
Assignor
ENQUIST, PAUL M.
Executed: 2015-07-14
Assignee
ZIPTRONIX, INC.
5400 GLENWOOD AVE., SUITE G-05, RALEIGH, NORTH CAROLINA, 27612
Covered Property (1)
Conductive Barrier Direct Hybrid Bonding
Application: 15/947,461 →
Publication: US 2018/0226371
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 1, 2019
From: ZIPTRONIX, INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 048482/0697 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →