Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers. An example wafer-level process fabricates running waveguides, optical routing, and direct-bonded optical interconnects for silicon photonics and optoelectronics packages when two wafers are joined.
1. An apparatus, comprising;
an optoelectronic chip comprising a first optical conduit on a first side of an optical interface, the first optical conduit comprising a vertical portion extending vertically to the optical interface;
an interposer comprising a second optical conduit on a second side of the optical interface, the second optical conduit comprising a lateral portion extending laterally relative to the vertical portion of the first optical conduit;
a first bond along the optical interface, the first bond comprising a direct bond between outer claddings of the first optical conduit and the second optical conduit; and
a second bond along the optical interface, the second bond comprising a direct bond between inner cores of the first optical conduit and the second optical conduit.
2. The apparatus of claim 1 , wherein:
the optoelectronic chip comprises a first planar surface exposing a cross-section of the first optical conduit, the first optical conduit comprising a first inner core and a first outer cladding around the first inner core; and
the interposer comprises an optical component on the second side of the optical interface, the optical component comprising a second planar surface exposing a cross-section of the second optical conduit, the second optical conduit comprising a second inner core and a second outer cladding around the second inner core, the first outer cladding directly bonded to the second outer cladding and the first inner core directly bonded to the second inner core.
3. The apparatus of claim 2 , wherein one or both of the optoelectronic chip and the optical component comprise an optical waveguide.
4. The optical apparatus of claim 1 , wherein the first bond comprises a direct oxide bond formed at room temperature, and the second bond is formed at an annealing temperature of the direct oxide bond.
5. The apparatus of claim 1 , wherein a composition of a first inner core of the first optical conduit and a second inner core of the second optical conduit is selected from the group consisting of Si, ZrO 2 , HfO 2 , TiO 2 , LiNbO 3 , Nb 2 O 5 , SrTiO 3 , and ZnS.
6. The apparatus of claim 1 , wherein a composition of a first outer cladding of the first optical conduit and a second outer cladding of the second optical conduit is selected from the group consisting of SiO 2 , a low k dielectric material, a polymer, a polyimide, a benzocyclobutene (BCB), and a parylene.
7. That apparatus of claim 1 , further comprising an optical interface between the first optical conduit and the second optical conduit with a noncircular cross-section in a plane of the optical interface.
8. The apparatus of claim 7 , wherein the optical interface further comprises a joint having a noncircular cross-section between a first outer cladding of the first optical conduit and a second outer cladding of the second optical conduit in the plane of the optical interface; and
wherein the optical interface further comprises a noncircular joint between a first inner core of the first optical conduit and a second inner core of the second optical conduit.
9. The apparatus of claim 7 , wherein the optical interface comprises a rectangular cross-section, a square cross-section, or a polygonal cross-section in a plane of the optical interface.
10. The apparatus of claim 7 , wherein one of the first optical conduit or the second optical conduit on one side of the optical interface has a noncircular, rectangular, polygonal, or square cross-section and the other optical conduit has a circular cross-section in the plane of the optical interface.
11. The apparatus of claim 1 , wherein the first bond and the second bond join the first optical conduit and the second optical conduit together in a layerless joint with no intervening layers between the first optical conduit and the second optical conduit; and
wherein the first bond and the second bond join the first optical conduit and the second optical conduit together in a gapless joint with no intervening gap between the first optical conduit and the second optical conduit.
12. The apparatus of claim 1 , further comprising electrical contacts associated with each of the first optical conduit and the second optical conduit, wherein a first set of electrical contacts of the first optical conduit are direct bonded to a second set of electrical contacts of the second optical conduit at the optical interface.
13. The apparatus of claim 1 , wherein the optoelectronic chip comprises an optoelectronic computing chip.
14. The apparatus of claim 13 , further comprising an optoelectronic memory stack mounted on the interposer laterally spaced from the optoelectronic computing chip, the optoelectronic computing chip and the optoelectronic memory stack optically coupled by way of the interposer.
15. The apparatus of claim 14 , wherein a third optical conduit of the optoelectronic memory stack is directly bonded to a fourth optical conduit of the interposer.
16. An apparatus, comprising;
an optoelectronic chip comprising a first optical conduit on a first side of an optical interface;
an interposer comprising a second optical conduit on a second side of the optical interface;
a first bond along the optical interface, the first bond comprising a direct bond between outer claddings of the first optical conduit and the second optical conduit; and
a second bond along the optical interface, the second bond comprising a direct bond between inner cores of the first optical conduit and the second optical conduit,
wherein the interposer comprises a second optoelectronic chip.
17. The apparatus of claim 1 , wherein the interposer comprises a substrate.
18. An apparatus, comprising;
a first optical conduit on a first side of an optical interface, the first optical conduit comprising a first set of electrical contacts;
a second optical conduit on a second side of the optical interface, the second optical conduit comprising a second set of electrical contacts;
a first bond along the optical interface, the first bond comprising a direct bond between outer claddings of the first optical conduit and the second optical conduit;
a second bond along the optical interface, the second bond comprising a direct bond between inner cores of the first optical conduit and the second optical conduit; and
a third bond along the optical interface, the third bond comprising a direct bond between a first electrical contact of the first set of electrical contacts and a second electrical contact of the second set of electrical contacts.
19. The apparatus of claim 18 , further comprising:
a first optical component on the first side of the optical interface, the first optical component comprising a first planar surface exposing a cross-section of the first optical conduit, the first optical conduit comprising a first inner core and a first outer cladding around the first inner core; and
a second optical component on the second side of the optical interface, the second optical component comprising a second planar surface exposing a cross-section of the second optical conduit, the second optical conduit comprising a second inner core and a second outer cladding around the second inner core, the first outer cladding directly bonded to the second outer cladding and the first inner core directly bonded to the second inner core.
20. The apparatus of claim 19 , wherein the first optical component comprises an optoelectronic chip.
21. The apparatus of claim 20 , further comprising a third optical component mounted to the second optical component, the third optical component laterally offset from the first optical component.
22. The apparatus of claim 21 , wherein the third optical component comprises an optoelectronic memory stack.