Patent Assignment
Reel/Frame 053284/0895
Assignment of Assignor's Interest
Recorded: 2020-07-22
Pages: 4
Assignors
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2020-07-14
MANDALAPU, CHANDRASEKHAR
Executed: 2020-07-20
UZOH, CYPRIAN EMEKA
Executed: 2020-07-13
THEIL, JEREMY ALFRED
Executed: 2020-07-13
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Chemical Mechanical Polishing for Hybrid Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 6, 2018
From: FOUNTAIN, GAIUS GILLMAN, JR.; MANDALAPU, CHANDRASEKHAR; UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 047698/0362 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →