IP Library Assignment 044732/0170
Patent Assignment
Reel/Frame 044732/0170

Assignment of Assignor's Interest

Recorded: 2018-01-25 Pages: 3
Assignors
HUANG, SHAOWU
Executed: 2018-01-18
DELACRUZ, JAVER A.
Executed: 2018-01-18
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Interface Structures and Methods for Forming Same
Application: 15/709,309 →
Publication: US 2018/0096931
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →