Heterogeneous device
A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating material. A portion of the first substrate is removed to leave a remaining portion. A third substrate having a coefficient of thermal expansion (CTE) substantially the same as a CTE of the first substrate is bonded to the remaining portion. The bonded substrates are heated to facilitate electrical contact between the first and second contact structures. The third substrate is removed after heating to provided a bonded structure with reliable electrical contacts.
1. A device, comprising:
a first element having a first major portion and a first bonding structure comprising a first metal bonding structure and a first insulating portion on the first major portion, the first major portion comprising a first material having a first coefficient of thermal expansion (CTE);
a second element having a second major portion and a second bonding structure comprising a second metal bonding structure and a second insulating portion on the second major portion, the second major portion comprising a second material having a second CTE different from the first CTE, the second metal bonding structure being direct metal bonded to the first metal bonding structure of the first element and the first insulating portion being direct bonded to the second insulating portion; and
a third element bonded to the first element, the third element comprising a third major portion having a third CTE substantially the same as the second CTE.
2. The device of claim 1 , wherein the first element is thinner than the second element.
3. The device of claim 2 , wherein the first element has a thickness that would cause distortion to the first element in the absence of the third element if heated to a temperature sufficient for direct metal-to-metal bonding.
4. The device of claim 1 , wherein at least one of the first and second metal bonding structures comprises a thermally expanded metal contact.
5. The device of claim 1 , wherein the third element is configured to reduce distortion to the first element so as to allow a direct connection between the first and second direct metal bonding structures.
6. The device of claim 1 , wherein the first major portion of the first element and the second major portion of the second element are made of different semiconductor materials.
7. The device of claim 1 , wherein the first and second metal bonding structures comprise copper.
8. The device of claim 1 , wherein the third CTE is different from the second CTE by less than about 0.3 ppm/° C.
9. The device of claim 1 , wherein at least one of the first and second metal bonding structures comprises copper or nickel.
10. The device of claim 1 , wherein the first element has a thickness in a range of 1-10 microns.
11. The device of claim 1 , further comprising a via filled with conductive material connected to at least one of the first and second metal bonding structures.
12. The device of claim 11 , wherein the via is exposed on a surface of one of the first and second elements.
13. The device of claim 1 , wherein a difference between the first CTE and the second CTE is in a range of 2 ppm/° C. to 5 ppm/° C.
14. The device of claim 1 , wherein the first element is disposed between the second element and the third element.
15. A device, comprising:
a first element having a first substrate, a first metal bonding structure and a first insulating portion, the first metal bonding structure direct metal bonded to a second metal bonding structure of a second element having a second substrate, the first insulating portion direct bonded to a second insulating portion of the second element;
a third element bonded to the first element, the third element comprising a third substrate having a coefficient of thermal expansion (CTE) substantially the same as a CTE of the second substrate, the first element disposed between the second element and the third element; and
at least one of the first and second metal bonding structures comprises a thermally expanded metal contact.
16. The device of claim 15 , wherein the first element has a thickness that would cause distortion to the first element if heated in the absence of the third element to a temperature sufficient for direct metal-to-metal bonding between the first metal bonding structure and the second metal bonding structure.
17. The device of claim 15 , wherein the third element is configured to reduce distortion to the first element so as to allow a direct connection between the first and second metal bonding structures.
18. The device of claim 15 , wherein the first substrate and the second substrate are made of different semiconductor materials.
19. The device of claim 15 , wherein the first and second metal bonding structures comprise copper.
20. The device of claim 15 , wherein the third CTE is different from the second CTE by less than about 0.3 ppm/° C.
21. The device of claim 15 , wherein at least one of the first and second metal bonding structures comprises copper or nickel.
22. The device of claim 15 , wherein the first element has a thickness in a range of 1-10 microns.
23. The device of claim 15 , further comprising a via filled with conductive material connected to at least one of the first and second metal bonding structures.
24. The device of claim 23 , wherein the via is exposed on a surface of one of the first and second elements.
25. The device of claim 15 , wherein a difference in coefficient of thermal expansion (CTE) between the first element and the second element is in a range of 2 ppm/° C. to 5 ppm/° C.