Patent Assignment
Reel/Frame 044759/0797
Change of Name
Recorded: 2017-12-07
Pages: 3
Assignor
ZIPTRONIX, INC.
Executed: 2017-05-26
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(4)
Heterogeneous Device
3D Ic Method and Device
Three dimensional device integration method and integrated device
Application:
11/514,083 →
Publication:
US US20060292744A1
Bonded Structures with Integrated Passive Component
Application:
62/440,161 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Assignment of Assignor's Interest
Jul 25, 2017
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.; TONG, QIN-YI
To: ZIPTRONIX, INC.
Reel/Frame 043090/0857 →
Assignment of Assignor's Interest
Jul 25, 2017
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.
To: ZIPTRONIX, INC.
Reel/Frame 043090/0958 →
Assignment of Assignor's Interest
Dec 7, 2017
From: DELACRUZ, JAVIER A.; HUANG, SHAOWU; MIRKARIMI, LAURA WILLS
To: ZIPTRONIX, INC.
Reel/Frame 044333/0722 →
Assignment of Assignor's Interest
Dec 7, 2017
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.
To: ZIPTRONIX, INC.
Reel/Frame 044333/0554 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →