Patent Assignment
Reel/Frame 047775/0387
Assignment of Assignor's Interest
Recorded: 2018-12-14
Pages: 11
Assignors
TSAO, CHANG-CHEN
Executed: 2018-03-07
LU, KUO LIANG
Executed: 2018-03-13
LEE, RU-LIANG
Executed: 2018-03-06
CHUANG, SHENG-HSIANG
Executed: 2018-03-09
CHENG, YU-HUNG
Executed: 2018-03-09
TU, YEUR-LUEN
Executed: 2018-03-15
HU, CHENG-KANG
Executed: 2018-03-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Debonding System and Method