Patent Assignment
Reel/Frame 047784/0223
Assignment of Assignor's Interest
Recorded: 2018-12-14
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Packaging Substrate