Patent Assignment
Reel/Frame 047798/0025
Assignment of Assignor's Interest
Recorded: 2018-12-17
Pages: 4
Assignors
YEH, CHAO-HSIUNG
Executed: 2018-11-12
CHANG, HSUAN
Executed: 2018-11-12
WANG, JEN-TI
Executed: 2018-11-12
CHEN, CHIN-TSAN
Executed: 2018-11-12
CHUANG, KUO-FONG
Executed: 2018-11-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Wafer Processing Tool Capable of Detecting Wafer Warpage and Method for Detecting Wafer Warpage