Patent Assignment
Reel/Frame 047801/0163
Assignment of Assignor's Interest
Recorded: 2018-12-18
Pages: 4
Assignors
QIAN, YOU
Executed: 2018-12-14
CAMPANELLA PINEDA, HUMBERTO
Executed: 2018-12-14
KUMAR, RAKESH
Executed: 2018-12-14
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property
(1)
Microelectromechanical Systems Packages and Methods for Packaging a Microelectromechanical Systems Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.