Patent Assignment
Reel/Frame 047814/0415
Assignment of Assignor's Interest
Recorded: 2018-12-19
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2011-11-16
TSAI, HAO-YI
Executed: 2011-11-16
LII, MIRNG-JI
Executed: 2011-11-16
YU, CHEN-HUA
Executed: 2011-11-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Post-Passivation Interconnect Structure