Patent Assignment
Reel/Frame 047834/0588
Assignment of Assignor's Interest
Recorded: 2018-12-20
Pages: 3
Assignor
SAKUMA, TETSUYA
Executed: 2018-11-15
Assignee
ABLIC INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Semiconductor Device with Side Wall Protection Film for Bond Pad and Wiring
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.