Patent Assignment
Reel/Frame 047836/0351
Assignment of Assignor's Interest
Recorded: 2018-12-20
Pages: 9
Assignors
ODA, DAIZO
Executed: 2018-11-30
YAMADA, TAKASHI
Executed: 2018-11-30
ETO, MOTOKI
Executed: 2018-11-30
HAIBARA, TERUO
Executed: 2018-11-30
UNO, TOMOHIRO
Executed: 2018-12-10
Assignees
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
Covered Property
(1)
Copper Alloy Bonding Wire for Semiconductor Devices
Application:
16/311,125 →
Publication:
US 2020/0312808
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.