Patent Assignment
Reel/Frame 047841/0020
Assignment of Assignor's Interest
Recorded: 2018-12-21
Pages: 13
Assignors
GROOTHUIS, STEVEN K.
Executed: 2012-08-20
LI, JIAN
Executed: 2012-08-16
ZHANG, HAOJUN
Executed: 2012-08-16
SILVESTRI, PAUL A.
Executed: 2012-08-29
LI, XIAO
Executed: 2012-08-20
LUO, SHIJIAN
Executed: 2012-08-15
ENGLAND, LUKE G.
Executed: 2012-08-22
KEETH, BRENT
Executed: 2012-08-15
GANDHI, JASPREET S.
Executed: 2012-08-15
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Stacked Semiconductor Die Assemblies with Multiple Thermal Paths and Associated Systems and Methods
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 11 to Patent Security Agreement
Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048082/0860 →
Supplement No. 2 to Patent Security Agreement
Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048082/0889 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050718/0764 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051026/0568 →