IP Library › Assignment 047846/0126
Patent Assignment
Reel/Frame 047846/0126

Assignment of Assignor's Interest

Recorded: 2018-12-21 Pages: 3
Assignor
TAJIMA, SHINGO
Executed: 2014-06-04
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Semiconductor Device Having a Reduced Footprint of Wires Connecting a Dll Circuit with an Input/Output Buffer
Application: 16/230,699 →
Publication: US 2019/0122720
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 11 to Patent Security Agreement Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048082/0860 →
Supplement No. 2 to Patent Security Agreement Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048082/0889 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050718/0764 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051026/0568 →