Patent Assignment
Reel/Frame 047846/0616
Assignment of Assignor's Interest
Recorded: 2018-12-21
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including a Semiconductor Chip and Methods of Forming the Semiconductor Packages