Patent Assignment
Reel/Frame 047848/0701
Assignment of Assignor's Interest
Recorded: 2018-12-23
Pages: 3
Assignors
CHEN, CHIEN-CHOU
Executed: 2018-12-07
CHIEN, CHUN-HSIEN
Executed: 2018-12-07
YEH, WEN-LIANG
Executed: 2018-12-07
LIN, WEI-TI
Executed: 2018-12-07
Assignee
UNIMICRON TECHNOLOGY CORP.
NO.38, XINGBANG RD., GUISHAN IND. PARK, TAOYUAN, 330, TAIWAN
Covered Property
(1)
Chip Packaging Structure and Manufacturing Method Thereof