Patent Assignment
Reel/Frame 047849/0271
Assignment of Assignor's Interest
Recorded: 2018-12-24
Pages: 3
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, CHINA
Covered Property
(1)
Wafer-Level Packaging Method and Package Structure Thereof