Patent Assignment
Reel/Frame 047881/0798
Assignment of Assignor's Interest
Recorded: 2018-08-14
Pages: 3
Assignor
HSIEH, YU-TE
Executed: 2018-08-14
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Multi-Chip Packaging Structure for an Image Sensor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 1, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047399/0631 →
Release of Security Interest in Patents Recorded at Reel 047399, Frame 0631
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064078/0001 →