Patent Assignment
Reel/Frame 047886/0458
Assignment of Assignor's Interest
Recorded: 2018-10-29
Pages: 4
Assignors
CHEN, CHIEN-HSUN
Executed: 2018-10-23
TSAI, YU-LING
Executed: 2018-10-23
WU, JIUN YI
Executed: 2018-10-23
LEE, CHIEN-HSUN
Executed: 2018-10-23
LU, CHUNG-SHI
Executed: 2018-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method