Patent Assignment
Reel/Frame 047888/0136
Assignment of Assignor's Interest
Recorded: 2019-01-03
Pages: 4
Assignors
CHEN, JUN
Executed: 2018-11-29
XIA, ZHILIANG
Executed: 2018-11-28
XIAO, LI HONG
Executed: 2018-12-03
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, 430074, CHINA
Covered Property
(1)
Embedded Pad Structures of Three-Dimensional Memory Devices and Fabrication Methods Thereof