IP Library › Assignment 047895/0457
Patent Assignment
Reel/Frame 047895/0457

Assignment of Assignor's Interest

Recorded: 2019-01-03 Pages: 3
Assignor
PARTRIDGE, AARON
Executed: 2006-02-27
Assignee
SITIME CORPORATION
5451 PATRICK HENRY DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Wafer encapsulated microelectromechanical structure and method of manufacturing same
Patent: 8,871,551 →
Application: 11/593,404 →
Publication: US 2007/0172976
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 7, 2014
From: SITIME CORPORATION
To: CAPITAL IP INVESTMENT PARTNERS LLC
Reel/Frame 033279/0061 →
Release of Security Interest Nov 18, 2014
From: CAPITAL IP INVESTMENT PARTNERS LLC
To: SITIME CORPORATION
Reel/Frame 034201/0107 →
Assignment of Assignor's Interest Jan 3, 2019
From: GUPTA, PAVAN
To: SITIME CORPORATION
Reel/Frame 047895/0386 →
Assignment of Assignor's Interest Jan 3, 2019
From: LUTZ, MARKUS
To: SITIME CORPORATION
Reel/Frame 047895/0446 →