Patent Assignment
Reel/Frame 047929/0056
Assignment of Assignor's Interest
Recorded: 2019-01-08
Pages: 5
Assignors
HAMANO, KENICHI
Executed: 2018-12-07
OHNO, AKIHITO
Executed: 2018-12-10
MIZOBE, TAKUMA
Executed: 2018-12-10
SAKAI, MASASHI
Executed: 2018-12-10
KIMURA, YASUHIRO
Executed: 2018-12-07
MITANI, YOICHIRO
Executed: 2018-12-07
KANAZAWA, TAKASHI
Executed: 2018-12-11
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Wafer, Semiconductor Device, and Method for Producing Semiconductor Device