Patent Assignment
Reel/Frame 047942/0404
Assignment of Assignor's Interest
Recorded: 2019-01-09
Pages: 4
Assignors
TSAI, PO-HAO
Executed: 2018-12-24
HUNG, SHIH-TING
Executed: 2018-12-25
JENG, SHIN-PUU
Executed: 2018-12-25
WONG, TECHI
Executed: 2018-12-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure and Method for Forming the Same